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[2020-08-01]   Working student CoDesign Flow (f/m/d)
Jobbeschreibung
Job Description
The Intel Product Enablement Devices Group develops cutting-edge packaging solutions for Intel products. You will be part of the Packaging and Assembly team, focused on the innovation and development of advances System-in-Package solutions. You will join a very international team and you will be directly interacting with engineers and experts from Intel's R&D design teams worldwide.

We are looking forward to applications of motivated students from Munich area who can work 20 hours per week besides their studies. Since we would like to see you grow within your role and your responsibilities, we would appreciate a student who would be available for a longer duration of employment, preferably for 1-2 years.

Your tasks and responsibilities:

Research of current available publications;
Create Methodology and Implementation specification;
Develop scripts and methodologies to improve and automatize EDA tools;
Flow test and documentation;
Qualifications
Qualifications, Education and Technical Requirements:

Studying electrical engineering, physics, material sciences or similar; (in order to be considered for the position you need to be enrolled for the whole period of this student employment)
Knowledge of chip, package or board layout tools, e.g. Cadence Allegro, Cadence Innovus, Mentor Xpedition, Synopsys IC Compiler
Software development skills, especially knowledge of scripting languages (Tcl, Perl) and Git
Familiar with Linux
Package and Board layout technology fundamentals;
Excellent communication skills in English, German is a plus; Inside this Business Group
The Infrastructure and Platform Solutions Group (IPSG) builds the silicon and platform infrastructure for Intel's silicon design teams. IPSG is comprised of a reusable pool of infrastructure IP blocks, design enabling services such as tools and automation, and a best-in-class post silicon ecosystem that ramps quickly to high volume manufacturing and validation. Our primary mission is to protect Intel's brand by providing the infrastructure necessary to enable all of Intel's products to hit the market on a dependable and predictable cadence.

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